Language:en
  • zh-cn
  • en
  • ru
  • fr

Element(Hong Kong ) Technology

Product Details
  • image of Telecom>CYP15G0401TB-BGXC
  • image of Telecom>CYP15G0401TB-BGXC
Model CYP15G0401TB-BGXC
Product Category Telecom
Manufacturer Spansion (Cypress Semiconductor)
Description QUAD HOTLINK II
Encapsulation -
Package Tray
Quantity 13501
RoHS Status 1
Obtain quotation information
Price: $58.3578
Inventory: 13501
Enter Quantity

Quantity

Price

Total Price

6

$58.3578

$350.1468

image of Telecom>11549359
11549359
Model
11549359
Product Category
Telecom
Manufacturer
Spansion (Cypress Semiconductor)
Description
QUAD HOTLINK II
Encapsulation
-
Package
Tray
Quantity
7001
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrSpansion (Cypress Semiconductor)
SeriesHOTlink II™
PackageTray
Product StatusOBSOLETE
Package / Case256-BGA Exposed Pad
Mounting TypeSurface Mount
FunctionDriver
InterfaceLVTTL
Operating Temperature0°C ~ 70°C
Voltage - Supply3.135V ~ 3.465V
Current - Supply590mA
Supplier Device Package256-L2BGA (27x27)
Number of Circuits4
captcha

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
+86-15869849588
0