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Element(Hong Kong ) Technology

Product Details
  • image of Hot-Sale>XC7Z035-2FBG676E
  • image of Hot-Sale>XC7Z035-2FBG676E
Model XC7Z035-2FBG676E
Product Category Hot-Sale
Manufacturer XILINX
Description -
Encapsulation -
Quantity 11500
RoHS Status YES
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image of Hot-Sale>XC7Z035-2FBG676E
image of Hot-Sale>XC7Z035-2FBG676E
XC7Z035-2FBG676E
Model
XC7Z035-2FBG676E
Manufacturer
Encapsulation
-
Batchnumber
Remarks
-
Quantity
5000
Product parameters
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TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesZynq®-7000
PackageTray
Product StatusACTIVE
Package / Case676-BBGA, FCBGA
Speed800MHz
RAM Size256KB
Number of I/O130
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary AttributesKintex™-7 FPGA, 275K Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA
Supplier Device Package676-FCBGA (27x27)
ArchitectureMCU, FPGA
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