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Element(Hong Kong ) Technology

Product Details
  • image of Hot-Sale>DSPIC30F2010-30I/SP
  • image of Hot-Sale>DSPIC30F2010-30I/SP
Model DSPIC30F2010-30I/SP
Product Category Hot-Sale
Manufacturer MICROCHIP
Description -
Encapsulation -
Quantity 11500
RoHS Status YES
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image of Hot-Sale>DSPIC30F2010-30I/SP
image of Hot-Sale>DSPIC30F2010-30I/SP
DSPIC30F2010-30I/SP
Model
DSPIC30F2010-30I/SP
Manufacturer
Encapsulation
-
Batchnumber
Remarks
-
Quantity
5000
Product parameters
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TYPEDESCRIPTION
MfrRoving Networks (Microchip Technology)
SeriesdsPIC™ 30F
PackageTube
Product StatusACTIVE
Package / Case28-DIP (0.300", 7.62mm)
Mounting TypeThrough Hole
Speed30 MIPs
Program Memory Size12KB (4K x 24)
RAM Size512 x 8
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeInternal
Program Memory TypeFLASH
EEPROM Size1K x 8
Core ProcessordsPIC
Data ConvertersA/D 6x10b
Core Size16-Bit
Voltage - Supply (Vcc/Vdd)2.5V ~ 5.5V
ConnectivityI2C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Supplier Device Package28-SPDIP
Number of I/O20
DigiKey ProgrammableVerified
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